WoS SCIE Q3Scopus Q3SCImago #16,628CAS 3区Hybrid

Soldering & Surface Mount Technology

Abbreviation (ISO):Soldering Surf. Mount Technol

Country: England•WoS SCIE Quartile: Q3•Scopus SJR: 0.317•SCImago Rank: #16,628•Identifier (ISSN):0954-0911(Print)•Articles / Year: 33•Estimated Publication Fee (APC): $2,737 USD

Clarivate IF (2026)Q3

2.2

↑ +0.4

Leading citation impact metric from Clarivate Journal Citation Reports

JCR Release Date: 2026-06-17

H-Index (2021)

28 papers with at least that number of citations each

WoS: SCIE / JCRQ3

Self-Citation Rate11.8%

Safe Level (< 15%)Warning Level (> 20%)

Self-citation below 15% indicates strong scholarly independence.

Volume & Open AccessHybrid

33articles/year

1.14% Gold OA•93.55% Original Research

State Council for Professorship (HĐGSNN) Scoring

Quyết định số 26/QĐ-HĐGSNN ngày 11/7/2025 (Mục quốc tế)

1.75pts

Latest Max Score

Estimated (Dec 26)

Scoring Basis: WoS Q2 có IF ≥ 2.0(IF: 2.2)

HĐGSNN Score History

By article publication year

Year	Max Score	Evaluation Details	Source
2026	1.75đ	WoS Q2 có IF ≥ 2.0(IF: 2.2)	🔵 Computed
2025	1.50đ	WoS Q2(IF: 1.8)	🔵 Computed
2024	1.50đ	WoS Q2(IF: 1.7)	🔵 Computed
2023	1.75đ	WoS Q2 có IF ≥ 2.0(IF: 2)	🔵 Computed
2022	1.50đ	WoS Q2(IF: 1.494)	🔵 Computed
2021	1.50đ	WoS Q2(IF: 1.552)	🔵 Computed
2020	1.75đ	WoS Q2 có IF ≥ 2.0(IF: 2.164)	🔵 Computed
2019	1.50đ	WoS Q2(IF: 1.5)	🔵 Computed
2018	1.50đ	WoS Q2(IF: 1.137)	🔵 Computed

Note: Domestic journal scores are officially collected from annual HĐGSNN decisions across councils. International journal scores are dynamically computed according to Decision 26/QĐ-HĐGSNN based on quartile and citation metrics in the publication year.

Aims & Scope

Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International. The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.

Topics Covered (Recognized by AI)

Materials science90.6%Chemistry89.1%Composite material87.7%Metallurgy87.5%Physical chemistry87%Soldering85.8%Engineering77.1%Computer science51.8%Physics43.9%Electrical engineering31.3%Organic chemistry29.6%Quantum mechanics28.5%Operating system28.4%Thermodynamics26%

Primary Research Areas

Engineering & Technology Materials Science: Multidisciplinary

Official Website NLM PubMed Catalog SCImago Profile

SCImago & Scopus Journal Intelligence

Global SCImago ranking, SJR prestige index, Scopus coverage, and societal policy impact

Rank #16,628Scopus Q3SCImago Profile

Scopus Coverage:1989-2026

•

Scopus Broad Areas:EngineeringMaterials SciencePhysics and Astronomy

Scopus Citation Rank (SJR)Q3

0.317

Weighted prestige citation metric per document indexed in the Scopus database.

Tứ phân vị: Scopus Q3

Scopus H-Index (2025)

Measures cumulative publication volume and citation impact.

Scopus Database Indexed (2025)

Citations / Doc (2 years)

2.37

Average citations received per document published in the 2-year window.

2-Year Citation Window

Estimated Publication Fee (APC)

$2,737 USD

Estimated Article Processing Charge for Open Access publication.

Chi phí ước tính / bài báo

Scopus 3-Year Publication & Citation Window

3-Year Citations204

3-Year Documents97

Citable Documents97

Aggregated from Scopus database across the 3-year SJR evaluation window.

Societal Impact & Inclusivity (SCImago)

Policy Citations (Overton)0

Citations in government and international policy documents

Female Author Rate30.7%

Percentage of female authors published in the journal

Real-world societal policy reach and author gender diversity tracked by SCImago.

Scopus Subject Categories

Condensed Matter PhysicsQ3

Electrical and Electronic EngineeringQ3

Materials Science (miscellaneous)Q3

Chinese Academy of Sciences (CAS) Classification

Major / minor zone classification and CAS Early Warning List history

Major Category (Broad Field):

3区 (Zone 3)Materials Science

Minor Category (Specific Field):

4区ENGINEERING, MANUFACTURING

CAS Early Warning List History:

Updated annually: 2020 – 2024

2020

Not warned

2021

Not warned

2022

Not warned

2023

Not warned

2024

Not warned

Publishing & Editorial Information

Detailed publisher, peer-review turnaround, and publication cycle specifications

Publisher Review Speed

Updating

Average time to first editorial decision

Online Publication Speed

Updating

Time from acceptance to online publication

Official Acceptance Rate

Updating

Manuscript acceptance rate confirmed by the publisher

Open Access Model

Hybrid

OA publishing option or traditional subscription

Publisher

Emerald Group Publishing Ltd.

Publication Language

English

Frequency

Quarterly

Editorial Address

EMERALD GROUP PUBLISHING LIMITED, HOWARD HOUSE, WAGON LANE, BINGLEY, ENGLAND, W YORKSHIRE, BD16 1WA

Indexing & Databases

SCIEScopusPubMed

WoS Categories & Quartiles

Detailed JCR / JCI category rankings and quartile breakdown from Clarivate

Clarivate JCR & JCI

Category	Index	Rank	Quartile
ENGINEERING, ELECTRICAL & ELECTRONIC	JCRSCIE	229/369	Q3
ENGINEERING, MANUFACTURING	JCRSCIE	58/71	Q4
MATERIALS SCIENCE, MULTIDISCIPLINARY	JCRSCIE	348/472	Q3
METALLURGY & METALLURGICAL ENGINEERING	JCRSCIE	41/97	Q2
ENGINEERING, ELECTRICAL & ELECTRONIC	JCISCIE	243/371	Q3
ENGINEERING, MANUFACTURING	JCISCIE	54/71	Q4
MATERIALS SCIENCE, MULTIDISCIPLINARY	JCISCIE	319/473	Q3
METALLURGY & METALLURGICAL ENGINEERING	JCISCIE	43/97	Q2