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Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems. The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc. Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.

Signal Processing: Image Communication is an international journal for the development of the theory and practice of image communication. Its primary objectives are the following: To present a forum for the advancement of theory and practice of image communication. To stimulate cross-fertilization between areas similar in nature which have traditionally been separated, for example, various aspects of visual communications and information systems. To contribute to a rapid information exchange between the industrial and academic environments. The editorial policy and the technical content of the journal are the responsibility of the Editor-in-Chief, the Area Editors and the Advisory Editors. The Journal is self-supporting from subscription income and contains a minimum amount of advertisements. Advertisements are subject to the prior approval of the Editor-in-Chief. The journal welcomes contributions from every country in the world. Signal Processing: Image Communication publishes articles relating to aspects of the design, implementation and use of image communication systems. The journal features original research work, tutorial and review articles, and accounts of practical developments. Subjects of interest include image/video coding, 3D video representations and compression, 3D graphics and animation compression, HDTV and 3DTV systems, video adaptation, video over IP, peer-to-peer video networking, interactive visual communication, multi-user video conferencing, wireless video broadcasting and communication, visual surveillance, 2D and 3D image/video quality measures, pre/post processing, video restoration and super-resolution, multi-camera video analysis, motion analysis, content-based image/video indexing and retrieval, face and gesture processing, video synthesis, 2D and 3D image/video acquisition and display technologies, architectures for image/video processing and communication.

It is the aim of this journal to bring together in one publication outstanding papers reporting new and original work in the following areas: (1) applications of solid-state physics and technology to electronics and optoelectronics, including theory and device design; (2) optical, electrical, morphological characterization techniques and parameter extraction of devices; (3) fabrication of semiconductor devices, and also device-related materials growth, measurement and evaluation; (4) the physics and modeling of submicron and nanoscale microelectronic and optoelectronic devices, including processing, measurement, and performance evaluation; (5) applications of numerical methods to the modeling and simulation of solid-state devices and processes; and (6) nanoscale electronic and optoelectronic devices, photovoltaics, sensors, and MEMS based on semiconductor and alternative electronic materials; (7) synthesis and electrooptical properties of materials for novel devices.