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Mechatronics is the synergistic combination of precision mechanical engineering, electronic control and systems thinking in the design of products and manufacturing processes. It relates to the design of systems, devices and products aimed at achieving an optimal balance between basic mechanical structure and its overall control. The purpose of this journal is to provide rapid publication of topical papers featuring practical developments in mechatronics. It will cover a wide range of application areas including consumer product design, instrumentation, manufacturing methods, computer integration and process and device control, and will attract a readership from across the industrial and academic research spectrum. Particular importance will be attached to aspects of innovation in mechatronics design philosophy which illustrate the benefits obtainable by an a priori integration of functionality with embedded microprocessor control. A major item will be the design of machines, devices and systems possessing a degree of computer based intelligence. The journal seeks to publish research progress in this field with an emphasis on the applied rather than the theoretical. It will also serve the dual role of bringing greater recognition to this important area of engineering.

Integration's aim is to cover every aspect of the VLSI area, with an emphasis on cross-fertilization between various fields of science, and the design, verification, test and applications of integrated circuits and systems, as well as closely related topics in process and device technologies. Individual issues will feature peer-reviewed tutorials and articles as well as reviews of recent publications. The intended coverage of the journal can be assessed by examining the following (non-exclusive) list of topics: Specification methods and languages; Analog/Digital Integrated Circuits and Systems; VLSI architectures; Algorithms, methods and tools for modeling, simulation, synthesis and verification of integrated circuits and systems of any complexity; Embedded systems; High-level synthesis for VLSI systems; Logic synthesis and finite automata; Testing, design-for-test and test generation algorithms; Physical design; Formal verification; Algorithms implemented in VLSI systems; Systems engineering; Heterogeneous systems.

Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged. Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.

Microprocessors and Microsystems: Embedded Hardware Design (MICPRO) is a journal covering all design and architectural aspects related to embedded systems hardware. This includes different embedded system hardware platforms ranging from custom hardware via reconfigurable systems and application specific processors to general purpose embedded processors. Special emphasis is put on novel complex embedded architectures, such as systems on chip (SoC), systems on a programmable/reconfigurable chip (SoPC) and multi-processor systems on a chip (MPSoC), as well as, their memory and communication methods and structures, such as network-on-chip (NoC). Design automation of such systems including methodologies, techniques, flows and tools for their design, as well as, novel designs of hardware components fall within the scope of this journal. Novel cyber-physical applications that use embedded systems are also central in this journal. While software is not in the main focus of this journal, methods of hardware/software co-design, as well as, application restructuring and mapping to embedded hardware platforms, that consider interplay between software and hardware components with emphasis on hardware, are also in the journal scope.

The Journal of Electrostatics is the leading forum for publishing research findings that advance knowledge in the field of electrostatics. We invite submissions in the following areas: Electrostatic charge separation processes. Electrostatic manipulation of particles, droplets, and biological cells. Electrostatically driven or controlled fluid flow. Electrostatics in the gas phase.

Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems. The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc. Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.

Signal Processing: Image Communication is an international journal for the development of the theory and practice of image communication. Its primary objectives are the following: To present a forum for the advancement of theory and practice of image communication. To stimulate cross-fertilization between areas similar in nature which have traditionally been separated, for example, various aspects of visual communications and information systems. To contribute to a rapid information exchange between the industrial and academic environments. The editorial policy and the technical content of the journal are the responsibility of the Editor-in-Chief, the Area Editors and the Advisory Editors. The Journal is self-supporting from subscription income and contains a minimum amount of advertisements. Advertisements are subject to the prior approval of the Editor-in-Chief. The journal welcomes contributions from every country in the world. Signal Processing: Image Communication publishes articles relating to aspects of the design, implementation and use of image communication systems. The journal features original research work, tutorial and review articles, and accounts of practical developments. Subjects of interest include image/video coding, 3D video representations and compression, 3D graphics and animation compression, HDTV and 3DTV systems, video adaptation, video over IP, peer-to-peer video networking, interactive visual communication, multi-user video conferencing, wireless video broadcasting and communication, visual surveillance, 2D and 3D image/video quality measures, pre/post processing, video restoration and super-resolution, multi-camera video analysis, motion analysis, content-based image/video indexing and retrieval, face and gesture processing, video synthesis, 2D and 3D image/video acquisition and display technologies, architectures for image/video processing and communication.

It is the aim of this journal to bring together in one publication outstanding papers reporting new and original work in the following areas: (1) applications of solid-state physics and technology to electronics and optoelectronics, including theory and device design; (2) optical, electrical, morphological characterization techniques and parameter extraction of devices; (3) fabrication of semiconductor devices, and also device-related materials growth, measurement and evaluation; (4) the physics and modeling of submicron and nanoscale microelectronic and optoelectronic devices, including processing, measurement, and performance evaluation; (5) applications of numerical methods to the modeling and simulation of solid-state devices and processes; and (6) nanoscale electronic and optoelectronic devices, photovoltaics, sensors, and MEMS based on semiconductor and alternative electronic materials; (7) synthesis and electrooptical properties of materials for novel devices.